2026 Technical Program Under Construction
The 2026 program will be announced soon. Below is the 2025 program — see the type of sessions you can expect!
2025 Agenda & Technical Presentations
Click on the speaker name to check out the Biographies & Abstracts
Wednesday, September 17
9:00am
Registration
10:00am
Expo Opens
11:30am
Precision Repair with Solder Paste Jetting: Enhancing Traceability and Rework Quality with Non-Contact Technology
Customer Applications Engineer, Essemtec
12:45pm
Electronic Assembly Failures, Solutions and Lessons Learned for Long Term Reliability
Technical Solutions Manager, Zestron Americas
2:00pm
Complimentary Food
3:45pm
Thermal Profiling in Reflow Soldering: Ensuring Precision and Quality
Jose María Servín
Senior Process Engineer and Material Expert, Schaeffler
5:00pm
Round Table: Printing Process from EMS Perspective
Gene Dunn, Sr. Staff Process Engineer, Plexus Chicago
Tony Lentz, Chemist & Field Application, FCT Solder
Sergio Juarez, Mexico Director, Stentech
Filemón Villanueva, Screen Printing Specialist, ASMPT
6:30pm
Happy Hour
7:30pm
Expo Concludes
Thursday, September 18
9:00am
Registration
10:00am
Expo Opens
11:30am
Maximizing Throughput in Automated Functional Test Stations
David Salazar
Functional Testing Specialist, IB Test
12:45pm
Advancing Toward Single-Pass Cleaning: Leveraging New Technology, Extended Wash Zones, and Process Design to Boost Throughput Without Compromising Reliability
Debbie Carboni, Global Product Line Manager, KYZEN Corporation
Patrick Lawrence, Applications Engineer, ITWEAE
2:00pm
Complimentary Food
3:45pm
Lower Temperature Solder For Complex PCB Assembly
Iulia Muntele
Process Technology Development Manager, Sanmina
5:15pm
Considerations for Coating Materials and Protection Profiles for Electric Vehicle PCBA Reliability
Scott Parks
Senior Engineer, Actnano
6:30pm
Happy Hour
7:30pm
Expo Concludes