Agenda & Technical Presentations:
Click on the Speaker name to check out the Biographies & Abstracts
Wednesday, September 17
9:00 AM Registration
10:00 AM Expo Opens
11:30 AM Precision Repair with Solder Paste Jetting: Enhancing Traceability and Rework Quality with Non-Contact Technology. Speaker: Alonso Pulido, Customer Applications Engineer, Essemtec
12:45 PM Electronic Assembly Failures, Solutions and Lessons Learned for Long Term Reliability. Speaker: Denis Barbini, Ph.D., Technical Solutions Manager, Zestron Americas
2:00 PM Complimentary Food
3:45 PM Thermal Profiling in Reflow Soldering: Ensuring Precision and Quality. Speaker: Jose María Servín, Senior Process Engineer and Material Expert, Schaeffler
5:00 PM Round Table: Printing Process from EMS perspective. Speakers: Gene Dunn, Sr Staff Process Engineer, Plexus Chicago – Tony Lentz, Chemist & Field Application, FCT – Sergio Juarez, Mexico Director, Stentech - Filemón Villanueva, Screen Printing Specialist, ASMPT
6:30 PM Happy Hour
7:30 PM Expo Concludes
Thursday, September 18
9:00 AM Registration
10:00 AM Expo Opens
11:30 AM Maximizing Throughput in Automated Functional Test Stations. Speaker: David Salazar, Functional Testing Specialist, IB Test
12:45 PM Advancing Toward Single-Pass Cleaning: Leveraging New Technology, Extended Wash Zones, and Process Design to Boost Throughput Without Compromising Reliability. Speakers: Debbie Carboni, Global Product Line Manager, Electronics, Kyzen & Patrick Lawrence, Applications Engineer, ITWEAE
2:00 PM Complimentary Food
3:45 PM Lower Temperature Solder For Complex PCB Assembly. Speaker: Iulia Muntele, Process Technology Development Manager, Sanmina
5:15 PM Considerations for Coating Materials and Protection Profiles for Electric Vehicle PCBA Reliability. Speaker: Scott Parks, Senior Engineer, Actnano
6:30 PM Happy Hour
7:30 PM Expo Concludes